Molded interconnect devices (MIDs) Market Growth Overview and Growth Factors Details by Regions, Types & Applications 2025

Molded interconnect devices are three-dimensional electromechanical components. In addition, these devices are major components for various mechanical and electrical engineering application that are used in automotive and telecommunication industry. Molded interconnect devices can minimizes the number of parts in circuit saving space & reduce assembly time along with cost effective for complex electromechanical functions which in turn is predicted to increase the usage of MID deices in various end use application.

Additionally, molded interconnect devices combine with various internal parts that includes circuit board, connectors and cables among others. Moreover, automotive and telecommunication manufactures are now focusing to develop their product by integrating electrical & mechanical functions in a single product.

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This helps manufactures in saving production costs along with reducing their production time. Even though MIDs have been around for many years but these production adoption has not been widespread. Across the globe, increasing the adoption of smart devices has been observed in last couple of years. Thus, the molded interconnect devices market is likely to witness stable growth during the forecast period from 2017 – 2025 owing to frequent inventions in telecommunication and consumer electronics application are expected to increase in coming years.

The global molded interconnect devices market has been segmented on the basis of manufacturing process, end use industry and geography. Based on manufacturing process, the market for molded interconnect devices has been bifurcated into various types which includes laser direct structuring, two components injection molding and film back injection molding others. Laser direct structuring (LDS) begins with a single shot molding to generate the physical part of component. In 2016, the laser direct structuring segment hold the major market share among the other process segment.

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Additionally, laser direct structuring is anticipated to grow at a high CAGR rate during the forecast period. Based on end use industry, global molded interconnect devices market has been fragmented in various types which includes telecommunication, automotive, industrial and healthcare among others. Over the past few years, there has been a significant growth in the growing number of smart phones, tablets and smart devices which is favoring adoption of molded interconnect devices.

The global molded interconnect devices market is dominated by players such as Molex, MacDermid, Siemens, LPKF Laser & Electronics, Fujitsu, TE Connectivity, Harting, Select Connect Technologies among others.