Bond Wire Packaging Material Market: Analysis, Strategic Assessment, Trend Outlook And Business Opportunities 2016 - 2024
The global market for Bonding Wire Packaging Material is growing and is expected to increase during the forecasted period. The diameter of bonding wires ranges from 15 micrometers to several hundred micrometers for high-powered applications. An important market trend that is expected to boost the global Bonding Wire Packaging Material market is the migration to smaller diameter wires. This migration is primarily fueled by the increasing demand for miniaturization. Manufacturers are using bonding wires as an intermediate product opts for small diameter bonding wires because it is an effective way to reduce costs, as materials used in bonding wires such as gold accounts for majority of the expense. The growing demand for miniaturization in the semi-conductor industry is also leading to an increasing use of bonding wires as an important part of electronic assemblies. This is another factor driving the growth of the market for Bonding Wire Packaging Material. Fine and ult...