Technology News & Trends

CMP Pads : Introduction Chemical mechanical planarization (or polishing) [CMP] is an important step that is used for several times in the manufacturing process of semiconductors to remove excess materials at each layer of the wafer and to obtain a smooth surface This semiconductor manufacturing process is carried out with the help of a pad and slurry on a polishing tool. Pads and slurries are consumables used in the CMP process. CMP pads are used in the semiconductor industry to attain a balanced removal rate, planarization, and reduced defectivity performance Use of CMP pads is beneficial to produce small electronic components with accurate flat surface and polished wafers In the manufacture of CMP pads, various types of materials are used. These include silicon, silicon carbide, sapphire, gallium arsenide, and indium phosphide. CMP pads are used in several applications such as silicon wafer polishing, polishing glass and optics, and polishing special metals, plastics, and co...

CMP Pads : Introduction Chemical mechanical planarization (or polishing) [CMP] is an important step that is used for several times in the manufacturing process of semiconductors to remove excess materials at each layer of the wafer and to obtain a smooth surface This semiconductor manufacturing process is carried out with the help of a pad and slurry on a polishing tool. Pads and slurries are consumables used in the CMP process. CMP pads are used in the semiconductor industry to attain a balanced removal rate, planarization, and reduced defectivity performance Use of CMP pads is beneficial to produce small electronic components with accurate flat surface and polished wafers In the manufacture of CMP pads, various types of materials are used. These include silicon, silicon carbide, sapphire, gallium arsenide, and indium phosphide. CMP pads are used in several applications such as silicon wafer polishing, polishing glass and optics, and polishing special metals, plastics, and co...

CMP Pads: Introduction Chemical mechanical planarization (or polishing) [CMP] is an important step that is used for several times in the manufacturing process of semiconductors to remove excess materials at each layer of the wafer and to obtain a smooth surface This semiconductor manufacturing process is carried out with the help of a pad and slurry on a polishing tool. Pads and slurries are consumables used in the CMP process. CMP pads are used in the semiconductor industry to attain a balanced removal rate, planarization, and reduced defectivity performance Use of CMP pads is beneficial to produce small electronic components with accurate flat surface and polished wafers In the manufacture of CMP pads, various types of materials are used. These include silicon, silicon carbide, sapphire, gallium arsenide, and indium phosphide. CMP pads are used in several applications such as silicon wafer polishing, polishing glass and optics, and polishing special metals, plastics, and co...