Die Attach Machine Market: Set To Surge Significantly During 2020 - 2030
Die Attach Machine: Introduction Die attach machine , also known as die mount or die bond machine, is used to attach the silicon chip to the die cavity or die pad of the support structure of a semiconductor package. This process is done by two processes: eutectic die attach and adhesive die attach. Die attach equipment is used in both processes to mount the die in the semiconductor package. Die attach materials such as epoxy, polyimide, and silver-filled glass is used in the adhesive die attach process for mounting the die on the die cavity or die pad, whereas the eutectic die attach process uses eutectic alloy to attach the die to the cavity. The global die attach machine market is projected to expand at a rapid pace during the forecast period, due to increasing demand for die attach machines from the semiconductor sector. Global Die Attach Machine Market: Key Drivers Rise in demand for electronics products among consumers generates demand for chips, which is indirectly...