Die Attach Machine Market: Set To Surge Significantly During 2020 - 2030

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Die Attach Machine: Introduction

  • Die attach machine, also known as die mount or die bond machine, is used to attach the silicon chip to the die cavity or die pad of the support structure of a semiconductor package. This process is done by two processes: eutectic die attach and adhesive die attach. Die attach equipment is used in both processes to mount the die in the semiconductor package.
  • Die attach materials such as epoxy, polyimide, and silver-filled glass is used in the adhesive die attach process for mounting the die on the die cavity or die pad, whereas the eutectic die attach process uses eutectic alloy to attach the die to the cavity.
  • The global die attach machine market is projected to expand at a rapid pace during the forecast period, due to increasing demand for die attach machines from the semiconductor sector.

Global Die Attach Machine Market: Key Drivers

  • Rise in demand for electronics products among consumers generates demand for chips, which is indirectly expected to increase the demand for die attach machines during the forecast period.
  • Shift from manual die attach machines to automated die attach machines by end-users is anticipated to propel the die attach machine market in the next few years.
  • Stringent government regulations regarding workplace safety is also anticipated to boost the demand for die attach machines in end-use industries during the forecast period
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  • Growing demand for hybrid circuits from medical, military, photonics, and wireless electronics applications, is expected to boost the demand for die attach machines.
  • Increasing demand to reduce operation time and increase production capacity, and rising need to improve reliability and stability of machinery at different locations are some of the major factors projected to boost the global die attach machine market in the near future.
  • Increasing adoption of stacked die technology in IoT devices and rising demand for miniature electronic components is a major factor driving the usage of die attach machines, and this factor is estimated to propel the market during the forecast period.

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